Linux-libre 4.2-gnu

3 files changed, 89 insertions, 0 deletions

diff --git a/Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt b/Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt
new file mode 100644
index 000000000..d48fc5280
--- /dev/null
+++ b/Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt
@@ -0,0 +1,23 @@
+* Temperature Sensor on hisilicon SoCs
+
+** Required properties :
+
+- compatible: "hisilicon,tsensor".
+- reg: physical base address of thermal sensor and length of memory mapped
+  region.
+- interrupt: The interrupt number to the cpu. Defines the interrupt used
+  by /SOCTHERM/tsensor.
+- clock-names: Input clock name, should be 'thermal_clk'.
+- clocks: phandles for clock specified in "clock-names" property.
+- #thermal-sensor-cells: Should be 1. See ./thermal.txt for a description.
+
+Example :
+
+	tsensor: tsensor@0,f7030700 {
+		compatible = "hisilicon,tsensor";
+		reg = <0x0 0xf7030700 0x0 0x1000>;
+		interrupts = <0 7 0x4>;
+		clocks = <&sys_ctrl HI6220_TSENSOR_CLK>;
+		clock-names = "thermal_clk";
+		#thermal-sensor-cells = <1>;
+	}
diff --git a/Documentation/devicetree/bindings/thermal/qcom-spmi-temp-alarm.txt b/Documentation/devicetree/bindings/thermal/qcom-spmi-temp-alarm.txt
new file mode 100644
index 000000000..290ec06fa
--- /dev/null
+++ b/Documentation/devicetree/bindings/thermal/qcom-spmi-temp-alarm.txt
@@ -0,0 +1,57 @@
+Qualcomm QPNP PMIC Temperature Alarm
+
+QPNP temperature alarm peripherals are found inside of Qualcomm PMIC chips
+that utilize the Qualcomm SPMI implementation. These peripherals provide an
+interrupt signal and status register to identify high PMIC die temperature.
+
+Required properties:
+- compatible:      Should contain "qcom,spmi-temp-alarm".
+- reg:             Specifies the SPMI address and length of the controller's
+                   registers.
+- interrupts:      PMIC temperature alarm interrupt.
+- #thermal-sensor-cells: Should be 0. See thermal.txt for a description.
+
+Optional properties:
+- io-channels:     Should contain IIO channel specifier for the ADC channel,
+                   which report chip die temperature.
+- io-channel-names: Should contain "thermal".
+
+Example:
+
+	pm8941_temp: thermal-alarm@2400 {
+		compatible = "qcom,spmi-temp-alarm";
+		reg = <0x2400 0x100>;
+		interrupts = <0 0x24 0 IRQ_TYPE_EDGE_RISING>;
+		#thermal-sensor-cells = <0>;
+
+		io-channels = <&pm8941_vadc VADC_DIE_TEMP>;
+		io-channel-names = "thermal";
+	};
+
+	thermal-zones {
+		pm8941 {
+			polling-delay-passive = <250>;
+			polling-delay = <1000>;
+
+			thermal-sensors = <&pm8941_temp>;
+
+			trips {
+				passive {
+					temperature = <1050000>;
+					hysteresis = <2000>;
+					type = "passive";
+				};
+				alert {
+					temperature = <125000>;
+					hysteresis = <2000>;
+					type = "hot";
+				};
+				crit {
+					temperature = <145000>;
+					hysteresis = <2000>;
+					type = "critical";
+				};
+			};
+		};
+	};
+
diff --git a/Documentation/devicetree/bindings/thermal/thermal.txt b/Documentation/devicetree/bindings/thermal/thermal.txt
index 29fe0bfae..8a49362de 100644
--- a/Documentation/devicetree/bindings/thermal/thermal.txt
+++ b/Documentation/devicetree/bindings/thermal/thermal.txt
@@ -167,6 +167,13 @@ Optional property:
 			by means of sensor ID. Additional coefficients are
 			interpreted as constant offset.
 
+- sustainable-power:	An estimate of the sustainable power (in mW) that the
+  Type: unsigned	thermal zone can dissipate at the desired
+  Size: one cell	control temperature.  For reference, the
+			sustainable power of a 4'' phone is typically
+			2000mW, while on a 10'' tablet is around
+			4500mW.
+
 Note: The delay properties are bound to the maximum dT/dt (temperature
 derivative over time) in two situations for a thermal zone:
 (i)  - when passive cooling is activated (polling-delay-passive); and
@@ -546,6 +553,8 @@ thermal-zones {
 		 */
 		coefficients =		<1200	-345	890>;
 
+		sustainable-power = <2500>;
+
 		trips {
 			/* Trips are based on resulting linear equation */
 			cpu_trip: cpu-trip {